SMT Equipment Introduction
Professional Surface Mount Technology Equipment
Production Line Equipment Capabilities
| Line | Brand | Model | Precision (Chip) | Capacity per Hour |
|---|---|---|---|---|
| 1 | Yamaha | YG-G5S2+YG-G5S2+YG-G5S2 | 01005 | 234,500 Chip |
| 2 | Yamaha/Hitachi | YG-G5S + YG-G5 | 01005 | 121,500 Chip |
| 3 | Hitachi | YG-G5 + YG-G5 | 01005 | 121,500 Chip |
🔧 Production Line Configuration
- • Three production lines with flexible SMD capacity configuration, optimized according to customer product component count or precision requirements
- • All SMD lines are equipped with fully automatic printers to enhance process efficiency
✓ Quality Assurance
- • Equipped with 3 TRI AOI units, all products undergo full AOI inspection to enhance product efficiency
- • Full-line ESD protection to safeguard products from electrostatic damage
🏭 Professional Equipment
Equipped with American IGS nitrogen generator, providing continuous nitrogen supply for reflow ovens
Production Line Process
LINE 1
PCB Loader
→
Stacker
→
Auto Solder Paste Printer
→
SPI
→
High-Speed Machine
→
High-Speed Machine
→
High-Speed Machine (with TRAY feeder)
→
20-Zone Nitrogen Reflow Oven
→
Board Unloader
→
AOI
LINE 2
PCB Loader
→
Stacker
→
Auto Solder Paste Printer
→
SPI
→
High-Speed Machine
→
High-Speed Machine (with TRAY feeder)
→
20-Zone Nitrogen Reflow Oven
→
Board Unloader
→
AOI
LINE 3
PCB Loader
→
Stacker
→
Auto Solder Paste Printer
→
Solder Paste Inspection CCD Magnifier
→
High-Speed Machine
→
High-Speed Machine (with TRAY feeder)
→
16-Zone Reflow Oven
→
AOI
Process Capability Specifications
LINE 1 Process Capabilities
Stencil Size Range
L 750mm × W 750mm (MAX)
IC Minimum Pitch
0.30mm
PCB Maximum Size
L 610mm × W 510mm
Chip Minimum Size
0201 (0.25mm × 0.125mm)
Component Maximum Size
72mm × 72mm
Connector Maximum Size
150mm × 26mm
BGA Minimum Ball Pitch
0.20mm (Min)
BGA Minimum Ball Diameter
0.13mm (Min)
QFP Minimum Lead Pitch
0.30mm (Min)
Stencil Cleaning Frequency
1 time / 10 Pieces
YAMAHA Σ-G5S2 Mounting Accuracy:
• 0201~008004 Chip: 25μm(3σ) ; IC: 15μm(3σ)
LINE 2 Process Capabilities
Stencil Size Range
L 737mm × W 737mm (MAX)
IC Minimum Pitch
0.30mm
PCB Maximum Size
L 610mm × W 510mm
Chip Minimum Size
03015 (0.3mm × 0.15mm)
Component Maximum Size
72mm × 72mm
Connector Maximum Size
100mm × 26mm
BGA Minimum Ball Pitch
0.25mm (Min)
BGA Minimum Ball Diameter
0.13mm (Min)
QFP Minimum Lead Pitch
0.30mm (Min)
Stencil Cleaning Frequency
1 time / 10 Pieces
Equipment Mounting Accuracy:
• YAMAHA Σ-G5S: 03015~06005 Chip: 30μm(3σ) ; IC: 15μm(3σ)
• HITACHI Σ-G5: 01005~0402 Chip: 30μm(3σ) ; IC: 15μm(3σ)
LINE 3 Process Capabilities
Stencil Size Range
L 737mm × W 737mm
IC Minimum Pitch
0.30mm
PCB Maximum Size
L 610mm × W 510mm
Chip Minimum Size
03015 (0.3mm × 0.15mm)
Component Maximum Size
72mm × 72mm
Connector Maximum Size
100mm × 26mm
BGA Minimum Ball Pitch
0.25mm (Min)
BGA Minimum Ball Diameter
0.13mm (Min)
QFP Minimum Lead Pitch
0.30mm (Min)
Stencil Cleaning Frequency
1 time / 10 Pieces
HITACHI Σ-G5 Mounting Accuracy:
• 01005~0402 Chip: 30μm(3σ) ; IC: 15μm(3σ)
Main SMT Equipment
| Equipment Name | Brand | Model | Quantity | Remarks |
|---|---|---|---|---|
| Laser Marking Machine | PSP | C460A | 1 | PCB Engraving QR Code |
| Nitrogen Generator | IGS | NHS-150 | 1 | 60 Nm3H, 99.99% |
| Stencil Cleaning Machine | OKI | ACT-100 | 1 | Stencil Cleaning |
| Fully Auto Solder Paste Printer | YAMAHA | YCP-10 | 1 | PCB Size:510×460mm |
| Fully Auto Solder Paste Printer | GKG | GLE | 1 | PCB Size:510×510mm |
| Fully Auto Solder Paste Printer | EKRA | XPRT 5 | 1 | PCB Size:460×460mm |
| 3D SPI Solder Paste Inspection | ZHENHUAXING | V860L | 1 | PCB Size:510×460mm |
| 3D SPI Solder Paste Inspection | ZHENHUAXING | V850E | 1 | PCB Size:400×330mm |
| High-Speed Mounter | YAMAHA | Σ-G5S2 | 3 | PCB Size:610×510mm with TRAY feeder×1 |
| High-Speed Mounter | YAMAHA | Σ-G5S | 1 | PCB Size:610×510mm |
| High-Speed Mounter | HITACHI | Σ-G5 | 3 | PCB Size:610×510mm with TRAY feeder×2 |
| Reflow Oven | YUANXING | YX-LFHACRF | 2 | 20 Zones |
| Reflow Oven | YUANXING | HD-NAACRF | 2 | 16 Zones |
| X-RAY | SHIMADZ | AMX-1000 PLUS | 1 | Inspection & Analysis |
| AOI | TRI | TR7700L SIII DT | 3 | with Repair Station PCB Size:510×460mm |
| BGA Rework Station | GENS | BGA 936USB | 1 | BGA Rework |
Learn More About Our Equipment
Want to learn more about our SMT equipment capabilities? Feel free to contact us, and we will provide you with professional technical consultation services.
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